Timothy O. Drews
Department of Chemical and Biomolecular Engineering
University of Illinois at Urbana-Champaign
600 South Mathews Avenue, Box C-3, MC 712
Urbana, Illinois 61801
Office Phone: 217-244-6592
Home Phone: 217-398-3059
todrews@uiuc.edu
Anticipated Graduation: May 2004
Advisors: Richard Alkire and Richard Braatz
Thesis: Multi-Scale Simulations of Nanofabricated Structures: Application to Copper Electrodeposition for Microelectronics Applications
May 2001
Advisors: Richard Alkire and Richard Braatz
Thesis: Multi-Scale Simulations of Copper Electrodeposition from a Multiple Additive System
Graduated with University Honors and Carnegie Institute of Technology Honors, May 1999
Undergraduate Research Advisor: Spyros Pandis
Research Project: Evaluation and Improvement of a Three-Dimensional Multiphase Atmospheric Pollution Model
Finalist, Best Student Paper Award, Supercomputing 2001 (2001)
Drickamer Fellowship for Outstanding Graduate Research, Univ. of Illinois (2002)
Hanratty Travel Award, Univ. of Illinois (2002)
Founder and Chair, Biannual Graduate Student Research Symposium in Chemical and Biomolecular Engineering, Univ. of Illinois (2002-2003)
Co-author, two NSF-PACI National Resource Allocation Committee (NRAC) grants, 261,650 CPU hours (in 2002) and 449,580 CPU hours (in 2003)
Developer and Instructor, Semester-long course on Kinetic Monte Carlo simulations (ChBE 469E), Univ. of Illinois (2003)
1. T. O. Drews, J. C. Ganley, and R. C. Alkire, “Evolution of Surface Roughness during Copper Electrodeposition in the Presence of Additives: Comparison of Experiments and Monte Carlo Simulations,” J. Electrochem. Soc., 150 (5), C325 (2003).
2. T. O. Drews, E. G. Webb, D. L. Ma, J. Alameda, R. D. Braatz, and R. C. Alkire, “Coupled Mesoscale-Continuum Simulations of Copper Electrodeposition in a Trench,” submitted for publication in the AIChE J., accepted subject to minor revisions (2002).
3. T. O. Drews, R. D. Braatz, and R. C. Alkire, “Parameter Sensitivity Analysis of Monte Carlo Simulations of Copper Electrodeposition in the Presence of Multiple Additives,” accepted for publication in the J. Electrochem. Soc., accepted (2003).
4. T. O. Drews, S. Krishnan, J. Alameda, D. Gannon, R. D. Braatz, and R. C. Alkire, “Multi-scale Simulations of Copper Electrodeposition onto a Resistive Substrate,” submitted to IBM J. of Res. and Dev. (2003).
5. E. Rusli, T. O. Drews, D. L. Ma, R. C. Alkire, and R. D. Braatz. “Nonlinear Feedback Control of a Coupled Kinetic Monte Carlo-Finite Difference Simulation,” to be submitted to Journal of Process Control (2003).
6. E. J. Hukkanen, T. O. Drews, R. C. Alkire, and R. D. Braatz. “Parameter Sensitivity Analysis for Stochastic Simulation Codes,” to be submitted to J. of Comp. Phys. (2003).
7. E. Rusli, T. O. Drews, X. Li, R. C. Alkire, and R. D. Braatz. Nonlinear feedforward-feedback control of a mesoscale-continuum simulation of copper electrodeposition in a trench. to be submitted to Automatica (2003).
8. E. Rusli, T. O. Drews, R. D. Braatz, and R. C. Alkire. “A Control Systems Approach to Understanding the Effects of Multiple Time Scales on the Numerical Stability and Accuracy of Multiscale Simulation Codes,” to be submitted to Automatica (2003).
9. S. Krishnan, R. Bramley, D. Gannon, R. Ananthakrishnan, M. Govindaraju, A. Slominski, Y. Simmhan, J.Alameda, R. Alkire, T. Drews, and E. Webb, “The XCAT Science Portal,” Scientific Programming, 10, 303 (2002).
1. S. Krishnan, R. Bramley, D. Gannon, M. Govindaraju, R. Indurkar, A. Slominski, B. Temko, R. C. Alkire, T. O. Drews, E. G. Webb, and J. Alameda, “The XCAT Science Portal,” Supercomputing 2001, Best Student Paper Finalist, Paper 287, Denver, Colorado (2001). Paper available online at http://www.sc2001.org/papers/pap.pap287.pdf
1. T. O. Drews, R. Gunawan, J. Alameda, R. D. Braatz, and R. C. Alkire, “Parameter Estimation and Multi-Scale Simulations of Surface Roughness Evolution During Copper Electrodeposition,” presented at the 200th Meeting of the Electrochemical Society, Symposium on Fundamental Aspects of Electrodeposition and Dissolution, San Francisco, California, (2001).
3. T. O. Drews, E. Rusli, E. G. Webb, J. Alameda, R. D. Braatz, and R. C. Alkire, “A Multi-Scale Model of Copper Electrodeposition in On-Chip Interconnects: Nonlinear Systems Analysis for Linked Multi-Scale Codes,” AIChE Annual Meeting, Reno, Nevada (2001).
4. T. O. Drews, J. Alameda, R. D. Braatz, and R. C. Alkire, “Integration of Linked Continuum-Mesoscale Codes with Experimental Data: The Role of Additives During Copper Electrodeposition,” AIChE Annual Meeting, Reno, Nevada (2001).
5. T. O. Drews, S. Krishnan, J. Alameda, D. Gannon, R. D. Braatz, and R. C. Alkire, “Multi-Scale Simulations of Copper Electrodeposition onto a Resistive Substrate,” AIChE Annual Meeting, Indianapolis, Indiana (2002).
6. E. J. Hukkanen, T. O. Drews, R. C. Alkire, and R. D. Braatz, “Parameter Sensitivity Analysis for Stochastic Simulation Codes, with Application to a Multiscale Simulation Code,” AIChE Annual Meeting, Indianapolis, Indiana (2002).
7. J. Alameda, R. Alkire, R. Braatz, T. Drews, R. Bramley, D. Gannon, M. Gower, S. Hampton, B. Jewett, S. Krishnan, K. Nahar, H. Rehn, and R Wilhelmson, “The Alliance Science Portal,” AIChE Annual Meeting, Indianapolis, Indiana (2002).
8. T. O. Drews, S. Krishnan, J. Alameda, D. Gannon, R. D. Braatz, and R. C. Alkire, “Multi-Scale Simulations of Copper Electrodeposition onto a Resistive Substrate,” 201st Meeting of the Electrochemical Society, Salt Lake City, Utah (2002).
9. T. O. Drews, S. Krishnan, J. Alameda, D. Gannon, R. D. Braatz, and R. C. Alkire, “Multi-Scale Simulations of Copper Electrodeposition onto a Resistive Substrate,” poster presented at the Gordon Research Conference on Electrodeposition, Colby-Sawyer College, New London, New Hampshire (2002).
10. T. O. Drews, E. J. Hukkanen, R. D. Braatz, and R. C. Alkire, “Parameter Sensitivity Analysis of Stochastic Simulation Codes,” SIAM Conference on Computational Science and Engineering, Computational Chemistry and Chemical Engineering Symposium, San Diego, California (2003).
11. E. Rusli, T. O. Drews, D. L. Ma, R. C. Alkire, and R. D. Braatz, “Nonlinear Feedback Control of a Coupled Kinetic Monte Carlo-Finite Difference Code,” submitted to the Proc. of the International Symposium on Advanced Control of Chemical Processes, Hong Kong (2003).
12. R. D. Braatz, R.C. Alkire, E. G. Seebauer, T. O. Drews, R. Gunawan, and M. Y. L. Jung, “Systems Engineering of Materials Manufacturing Processes at the Nanoscale,” Proc. of the 3rd Chemical Engineering Conf. for Collaborative Research in Eastern Mediterranean, Paper W-4.3, Thessaloniki, Greece, May 13-15, 2003.
13. E. Rusli, T. O. Drews, X. Li, R. C. Alkire, and R. D. Braatz, “Nonlinear Feedforward-Feedback Control of a Coupled Kinetic Monte Carlo-Finite Difference Simulation,” submitted to Poster Session 10B08 at the AIChE Annual Meeting, San Francisco (2003).
14. T. O. Drews, X. Li, F. Xue, H. Deligianni, P. Vereecken, E. Cooper, P. Andricacos, R. D. Braatz, and R. C. Alkire, “Parameter Estimation of a Copper Electrodeposition Additive Mechanism using a Multi-Scale Simulation Code,” submitted to Poster Session 10B08 at the AIChE Annual Meeting, San Francisco (2003).
15. T. O. Drews, A. Radisic, J. Erlebacher, R. D. Braatz, P. C. Searson, and R. C. Alkire, “Atomic-Scale Kinetic Monte Carlo Simulations of Copper Nucleation: Investigation of Attachment Limited Rate Laws,” submitted to Session TK002 at the AIChE Annual Meeting, San Francisco (2003).
16. T. O. Drews, X. Li, F. Xue, H. Deligianni, P. Vereecken, E. Cooper, P. Andricacos, R. D. Braatz, and R. C. Alkire, “Parameter Estimation of a Copper Electrodeposition Additive Mechanism using Data Obtained from a D-Optimal Experimental Design,” submitted to Session TK002 at the AIChE Annual Meeting, San Francisco (2003).
17. T. O. Drews, R. D. Braatz, and R. C. Alkire, “Multi-Scale Simulations of Nanofabricated Structures:
Application to Copper Electrodeposition for Microelectronics Applications,” submitted to Poster Session 04015 at the AIChE Annual Meeting, San Francisco (2003).
18. R. D. Braatz, R. C. Alkire, E. G. Seebauer, T. O. Drews, R. Gunawan, M. Y. L. Jung, and E. Rusli. “Future Directions in Nanosystems Engineering and Control,” AIChE Annual Meeting, San Francisco, CA, November 16-21, 2003. submitted to Session 10B06 at the AIChE Annual Meeting, San Francisco (2003).
19. E. Rusli, T. O. Drews, X. Li, R. C. Alkire, and R. D. Braatz, “Understanding the Numerical Stability and Accuracy of Dynamically Coupled Multiscale Simulation Codes: A Control Systems Approach,” submitted to Session 10B15 at the AIChE Annual Meeting, San Francisco (2003).
20. T. O. Drews, R. D. Braatz, and R. C. Alkire, “Multi-Scale Simulations of Nanofabricated Structures: Application to Copper Electrodeposition for Applications in Electronic Devices,” poster presented at the Nanotechnology Industry Workshop, Center for Nanoscale Science and Technology, University of Illinois at Urbana-Champaign, Urbana, Illinois (2003).
Computational Skills
C++, FORTRAN 77, FORTRAN 90, Perl, OpenMP, MPI, Matlab, Mathcad, HTML, UNIX, Windows
Electrochemical Engineering (ChE 388)
Fluid Mechanics and Heat Transfer (ChE 371)
Synthesis and Design of Chemical Systems (ChE 377)
Member of Tau Beta Pi National Engineering Honor Society
Member of The Electrochemical Society